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Zhou, Jindong (周巾栋) |
2021 - present
B.S. ShanghaiTech University |
| |
| Research Interests: 3D IC |
| Email: zhoujd@@shanghaitech.edu.cn |
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Zhang, Huifan (张汇凡)
|
2022 - present
B.S. ShanghaiTech University |
| |
| Research Interests: AI for RFIC Design |
| Email: zhanghf@@shanghaitech.edu.cn |
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Zhu,
Yankun (朱演坤) |
2023 - present
B.S. ShanghaiTech University |
| |
| Research Interests: Hardware Security (FPGA) |
| Email: zhuyk@@shanghaitech.edu.cn |
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An, Lihua (安丽华) |
2023 - present
B.S. ShanghaiTech University |
| |
| Research Interests: In-Memory Computing |
Email: anlh2022@@shanghaitech.edu.cn
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Hu, Yun (胡筠) |
2023 - present
B.S. Beihang University |
| |
| Research Interests: Optical Neural Networks |
| Email: huyun@@shanghaitech.edu.cn |
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Wang, Shanlai (王善来)
|
2023 - present
M.E. Shanghai University |
| |
| Research Interests: SoC Design |
| Email: wangshl2023@@shanghaitech.edu.cn |
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Gong, Rui (龚芮) |
2024 - present
B.S. ShanghaiTech University |
| Research Interests: Chiplet/3D Chip Interconnection |
| Email: gongrui2024@@shanghaitech.edu.cn |
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Yang, Liyu (杨力瑜)
|
2024 - present
B.S. ShanghaiTech University |
| |
| Research Interests: 3D IC |
| Email: yangly2024@@shanghaitech.edu.cn |
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Qiao, Hongyuhan (乔洪煜寒) |
2024 - present
B.S. Soochow University |
| |
| Research Interests: SoC Design |
| Email: qiaohyh2024@@shanghaitech.edu.cn |
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Lin, Ranxi (林冉曦)
|
2024 - present
M.E. Institute of Semiconductors, CAS |
| |
| Research Interests: 3D IC |
| Email: linrx2024@@shanghaitech.edu.cn |
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Li, Jiayi (李嘉毅) |
2025 - present
B.S. Changchun University of Science and Technology |
| |
| Research Interests: 3D IC |
| Email: lijy22023@@shanghaitech.edu.cn |
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Mao，Xinyin (茅馨尹)
|
2025 - present
B.S. Soochow University |
| |
| Research Interests: TBD |
| Email: maoxy12025@@shanghaitech.edu.cn |
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Ge, Zi'ang (葛梓昂) |
Master, 2025
B.S. Southeast University |
| |
| First Position: Ph.D. student at The Chinese University of Hong Kong |
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Weng, Wanzheng (翁万正) |
Master, 2025
B.S. China Agricultural University |
| |
| First Position: UniVista |
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Xiong, Xin (熊欣) |
Master, 2025
B.S. Beijing Institute of Technology |
| |
| First Position: Ph.D. student at Beijing Institute of Technology, Zhuhai |
|
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Zhou, Hongjian (周鸿坚) |
Master, 2024
B.S. Central South University |
| |
| First Position: Ph.D. student at Arizona State University, U.S.A |
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Sun, Jiang (孙江) |
Master, 2024
B.S. ShanghaiTech University |
| |
| First Employment: BEI JING Institute of Open Source Chip |
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Li,
Ziwen (李子文) |
Master, 2023
B.S. Dalian University of Technology |
| |
| First Employment: GigaDevice |
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Li, Yang (李扬) |
Master, 2023
B.S. Xidian University |
| |
| First Employment: Novosense |
|
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Qu,
Yuanchen (曲原辰) |
Master, 2023
B.S. ShanghaiTech University |
| |
| First Employment: Vastai Technologies |
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Ma, Yu (马郁) |
Ph.D., 2022
B.S. Qingdao University |
|
| |
| First Employment: AMD (Shanghai) |
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Zhang, Chengrui (张呈瑞)
|
Master, 2022
B.S. University of Electronic Science and Technology of China |
| |
| First Position: Ph.D. student at Peking University |
|
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Dong, Jinxin (董金昕) |
Master, 2022
B.S. Nanchang University |
|
| |
| First Position: Ph.D. student at NTU, Singapore |
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Zhang, Chenguang (张晨光) |
Master, 2021
B.S. Tianjin University |
| |
| First Position: Ph.D. student at Peking University |
|
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Liu, Yuan (刘远) |
Master, 2021
B.S. Xidian University |
|
| |
| First Employment: Cadence |
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Zheng, Linfeng (郑临风)
|
Master, 2021
B.S. Xi'an University of Technology |
| |
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| First Employment: Baidu |
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Liu, Lihao (刘力豪)
|
| Bachelor, 2021 |
| |
| |
| First Position: Ph.D. student at Fudan University |
|
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Wang, Lu (王璐) |
Master, 2020
B.S. Xidian University |
|
| |
| First Employment: Cadence |
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Wang, Ruoyu (王若禹)
|
| Bachelor, 2020 |
| |
| |
| First Position: Ph.D. student at Lehigh University,USA |
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Luo, Haocong (罗浩聪)
|
Bachelor, 2020
|
| |
| |
| First Position: Master student in SAFARI group at ETHZ |
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Wang, Leilei (王磊磊)
|
Ph.D., 2019
B.S. Shandong University |
|
| |
| First Employment: Baidu (Shanghai) |
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Gao, Wei (高薇)
|
Ph.D., 2019
B.S. Shanghai University |
| |
| |
| First Employment: Baidu (Shanghai) |
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Yang, Yajun (杨亚君) |
Master, 2019
B.S. Xidian University |
|
| |
| First Employment: ARM (Shanghai) |
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Jia, Dingcheng (贾鼎成)
|
Master, 2019
B.S. Hefei University of Technology |
| |
| |
First Employment: Marvell (Shanghai) |
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Lu, Minshan (鲁珉杉)
|
| Bachelor, 2019 |
| |
| |
| |
| First Position: Master at NTU/TUM |
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Zhao, Hui (赵晖) |
Master, 2018
B.S. Nanjing University of Science and Technology
|
| |
| First Employment: AMD (Shanghai) |
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Li, Yaguang (李亚光) |
Master, 2018
B.S., North China University of
Technology
|
| |
| First Position: Ph.D. student at Texas A&M University, U.S.A |
|
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Zhang, Jiuxin (张久鑫) |
Master, 2018
B.S. Shandong University |
| |
| |
| First Employment: Cadence (Shanghai) |
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Shang, Dejia (商德佳) |
Master, 2017
B.S. Wuhan University |
| |
| |
| First Employment: ARM (Shanghai) |
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Cai, Xiangwei (蔡想伟) |
Master, 2017
B.S. Harbin Institute of Technology (Weihai)
|
| |
| First Employment: Zhaoxin (Beijing) |
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Liu, Xiaochen (刘晓晨) |
Master, 2016
B.S. Xiamen University
|
| |
| |
| First Employment: Cadence (Shanghai) |
|
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Liao, Kai (廖凯) |
Master, 2016
B.S. Zhejiang University |
| |
| |
| First Employment: TP-Link (Shenzhen) |
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